Glavchev I.Petrova K.Ivanova M.2024-07-082024-07-082024-07-082024-07-082002-01-010142-941810.1016/S0142-9418(01)00066-6SCOPUS_ID:0036132242https://rlib.uctm.edu/handle/123456789/36Several compounds were used to design epoxy composites which would exhibit appropriate coefficients of thermal expansion (CTE): bisphenol A and diethyleneglycol based epoxy resins, seven different fillers and two hardeners. The CTE of these epoxy compositions with crystalline and amorphous filler was determined and its peak-like behavior as a function of temperature evaluated. © 2001 Elsevier Science Ltd. All rights reserved.enArticle