Bojinov M.Goel S.Ikäläinen T.Saario T.2024-07-102024-07-102024-07-102024-07-102024-04-011945-71110013-465110.1149/1945-7111/ad3fedSCOPUS_ID:85192210027https://rlib.uctm.edu/handle/123456789/939The interaction of copper with sulfide-containing simulated saline groundwater is studied by electrochemical techniques (voltammetry, current-time transients, and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide-containing groundwater, thus precluding the possibility of the development of localized corrosion modes.enArticle