Dimov D.Georgiev A.Spassova E.Assa J.Danev G.2024-07-102024-07-102024-07-102024-07-102010-01-011742-65961742-658810.1088/1742-6596/223/1/012034SCOPUS_ID:77954691466https://rlib.uctm.edu/handle/123456789/191A novel method was developed for physical deposition of thin polyimide layers by applying an argon plasma assisted process. The influence was investigated of the plasma on the combined molecular flux of the two thermally evaporated precursors - oxydianiline and pyromellitic dianhydride. The effects observed on the properties of the deposited films are explained with the increased energy of the precursor molecules resulting from the ion-molecular collisions. As could be expected, molecules with higher energy possess higher mobility and thus determine the modification of the films structure and their electrical properties. © 2010 IOP Publishing Ltd.enConference Paper