Characterization of anodized Al 1050 with electrochemically deposited Cu, Ni and Cu/Ni and their behavior in a model corrosive medium
creativework.keywords | AA1050, AC-electrochemical deposition, Anodization, Copper, Nickel | |
creativework.publisher | Korean Electrochemical Society | en |
dc.contributor.author | Girginov C. | |
dc.contributor.author | Kozhukharov S. | |
dc.contributor.author | Tsanev A. | |
dc.contributor.author | Dishliev A. | |
dc.date.accessioned | 2024-07-10T14:27:05Z | |
dc.date.accessioned | 2024-07-10T14:50:02Z | |
dc.date.available | 2024-07-10T14:27:05Z | |
dc.date.available | 2024-07-10T14:50:02Z | |
dc.date.issued | 2021-01-01 | |
dc.description.abstract | The specific benefits of the modified films formed on preliminary anodized aluminum, including the versatility of their potential applications impose the need for evaluation of the exploitation reliability of these films. In this aspect, the dura-bility of Cu and Ni modified anodized aluminum oxide (AAO) films on the low-doped AA1050 alloy was assessed through extended exposure to a 3.5% NaCl model corrosive medium. The electrochemical measurements by means of electrochemical impedance spectroscopy (EIS) and potentiodynamic scanning (PDS) after 24 and 720 hours of exposure have revealed that the obtained films do not change their obvious barrier properties. In addition, supplemental analyses of the coatings were performed, in order to elucidate the impact of the AC-deposition of Cu and Ni inside the pores. The scanning electron microscopy (SEM) images have shown that the surface topology is not affected and resembles the typical surface of an etched metal. The subsequent energy dispersive X-ray spectroscopy (EDX) tests have revealed a predominance of Cu in the combined AAO-Cu/Ni layers, whereas additional X-ray photoelectron (XPS) analyses showed that both metals form oxides with different oxidation states due to alterations in the deposition conditions, promoted by the application of AC-polarization of the samples. | |
dc.identifier.doi | 10.33961/JECST.2020.01235 | |
dc.identifier.issn | 2288-9221 | |
dc.identifier.issn | 2093-8551 | |
dc.identifier.scopus | SCOPUS_ID:85109150906 | en |
dc.identifier.uri | https://rlib.uctm.edu/handle/123456789/655 | |
dc.language.iso | en | |
dc.source.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85109150906&origin=inward | |
dc.title | Characterization of anodized Al 1050 with electrochemically deposited Cu, Ni and Cu/Ni and their behavior in a model corrosive medium | |
dc.type | Article | |
oaire.citation.issue | 2 | |
oaire.citation.volume | 12 |