Characterization and properties of highly adhesive titanium nitride and tungsten nitride thin films
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2008-05-01
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Abstract
The paper presents results on the physical characteristics and mechanical properties of titanium nitride (TiN) and tungsten nitride (W2N) thin films grown by reactive DC magnetron sputtering. The films were deposited in a system with several magnetron modules of different sputtering materials suitable for deposition of single-layer metal nitride films and multilayer nitride coatings. The deposition conditions were optimized to obtain films with the highest adhesion to substrates of machine steel and sintered hard alloy. The adhesion of the films was measured in dependence on two principal process parameters: the nitrogen partial pressure in the magnetron discharge gas mixture of nitrogen and argon and the substrate temperature. The composition of the TiN films was determined by Auger electron spectroscopy. The microstructure and the crystallization trend of the films were studied by transmission electron microscopy and selected area electron diffraction. The hardness of the films was examined using standard measuring methods. © 2008 IOP Publishing Ltd.