Effect of Sulfide Addition on the Corrosion Mechanism of Copper in Saline Groundwater Solution

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creativework.keywordscopper, corrosion modeling, localized corrosion, passivity
creativework.publisherInstitute of Physicsen
dc.contributor.authorBojinov M.
dc.contributor.authorGoel S.
dc.contributor.authorIkäläinen T.
dc.contributor.authorSaario T.
dc.date.accessioned2024-07-10T14:27:06Z
dc.date.accessioned2024-07-10T14:51:12Z
dc.date.available2024-07-10T14:27:06Z
dc.date.available2024-07-10T14:51:12Z
dc.date.issued2024-04-01
dc.description.abstractThe interaction of copper with sulfide-containing simulated saline groundwater is studied by electrochemical techniques (voltammetry, current-time transients, and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide-containing groundwater, thus precluding the possibility of the development of localized corrosion modes.
dc.identifier.doi10.1149/1945-7111/ad3fed
dc.identifier.issn1945-7111
dc.identifier.issn0013-4651
dc.identifier.scopusSCOPUS_ID:85192210027en
dc.identifier.urihttps://rlib.uctm.edu/handle/123456789/939
dc.language.isoen
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85192210027&origin=inward
dc.titleEffect of Sulfide Addition on the Corrosion Mechanism of Copper in Saline Groundwater Solution
dc.typeArticle
oaire.citation.issue4
oaire.citation.volume171
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